Thanks to our development work in new printed circuit board technology, like FELAM THERMOLINE® and FELAM GLASLINE®, we also specialise in manufacturing prototypes. With our FELAM THERMOLINE®prototypes we assist you in your development work right up to readiness for start of production regardless of whether the production run will be a one-off involving low figures or whether the market will require production outside Europe. FELA remains your partner throughout the process.

Within a delivery period of 2 or more days, we produce your prototypes for you using the following techniques:

• single-sided printed circuit boards using different materials and thicknesses
• printed circuit boards with through-connections on two sides using different materials and different copper thicknesses
• multilayer with through-connections of up to 20 layers using different materials and different copper thicknesses
• metal core circuit boards, single-sided, double-sided with through-connections and multilayer with up to 6 layers

Technical data

• Thickness of between 0.8 mm and 4.0 mm
• Min. core thickness 50 μm
• Conductor path width and spacing 150 μm
• Min. mechanical hole diameter 0.25 mm
• Max. Cu thickness on inside 105 μm / on outside 105 μm
• Buried via
• Blind via
• Jump V-cutting

strong>Materials

• FR-4 to Tg 170, metal core, aluminium and copper
• Halogen-free and RoHS-compliant base material

Surface coatings

• Probimer solder mask
• HAL (Hot-Air-Levelling procedure)
• Chemical Sn
• Chemical Ni/Au
• Galvanic Ni/Au
• Soft gold
• OSP (Organic Surface Protection)
• Chemical Ag

Screen printing variants

• Legend print
• Via print
• Carbon paint
• Solder resist