| 2008 |
Development of the first touch screen in FELAM GLASLINE® technology (patent applied)
FDA (Food and Drug Administration)
Registration for FELAM GLASLINE®
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| 2006 |
FELA becomes system supplier to FELAM GLASLINE®
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| 2005 |
Extension of production for FELAM® technologies. Applications submitted for more patents for FELAM®. Conclusion of exclusivity contracts with customers in special market segments.
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| 2004 |
Takeover of Laytronic, Metzingen, an insolvent manufacturer of printed circuit boards, and integration of staff, facilities and orders at the Schwenningen plant.
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| 2003 |
Sales activities are expanded through the founding of new field service offices in Germany, Switzerland, France and Austria.
Special IMS circuits (Insulated Metal Substrate) are the next step in the development of the FELAM® procedure. These are launched under the trade name of FELAM THERMOLINE®.
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| 2002 |
The FELAM® procedure is developed further, patent applications are filed for FELAM GLASLINE®, input systems made from glass. FELA wins an innovation award for this development./p>
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| 2000 |
Development of a new technology for the production of multilayer circuits. The procedure is established on the market under the name FELAM®.
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| 1999 |
In order to safeguard future growth, extension work at the VS-Schwenningen plant is completed. Total production area now 5,500 m2.
The current management team takes over the company and splits from the Photochemie Group. New name of FELA Leiterplattentechnik GmbH..
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| 1998 |
The sales office in Solingen is founded and the production range is extended through co- operation ventures with partners in China and Taiwan.
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| 1996 |
The Swiss parent company FELA Holding AG merges with the Swiss Photochemie Holding AG to form a group of companies known as the Photochemie Group. FELA Hilzinger GmbH is therefore also part of the Photochemie Group.
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| 1992 |
On 25.06.1992 FELA Hilzinger GmbH becomes the second German manufacturer of printed circuit boards to be DIN ISO 9002 certified.
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| 1991 |
The company takes over production of printed circuit boards from Mannesmann Kienzle. The facilities and staff are integrated in the VS-Schwenningen site.
A fire destroys the electroplating and wet production areas. Total damage €6.5 million.
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| 1988 |
The Swiss electronics group FELA becomes the company’s new majority shareholder. The company operates under the name FELA Hilzinger GmbH.
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| 1985 |
The company moves from its original site in Weilersbach to its current location in the Schwen- ningen district of Villingen-Schwenningen.
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| 1976 |
Start of production of multilayer printed circuit boards and PCBs with through-connections.
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| 1968 |
Production of the first single-sided printed circuit boards as a new product segment.
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| 1964 |
Company founded in the Weilersbach district of Villingen-Schwenningen, company initially prints signs and control panels.
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